Product Overview
The ultra-thin precision cooling plate is a miniaturized and lightweight thermal management solution developed for compact electronic devices. With ultra-thin integrated molding technology, the product is small in size, light in weight and high in integration, which can perfectly adapt to the narrow internal space of precision electronic equipment. It efficiently dissipates local concentrated heat of chips, CPUs and precision components, avoids performance degradation and crash failure caused by high temperature, and guarantees high-precision and long-term stable operation of electronic equipment.
Key Features at a Glance
- Stamped Channels: Complex flow paths formed in seconds at low cost, ideal for high-volume scaling.
- Leak-Proof Construction: Solid-state sealed for permanent, maintenance-free operation with no internal contaminants.
- Custom Configurable: Size, port locations, mounting bosses, and surface treatments can be tailored to your module layout.
- Fast Sample Turnaround: Functional prototypes delivered in weeks, using the same production-ready process.
- Certification Support: Full documentation and material traceability to assist with UL 1973 and UL 9540A compliance.
Parameter Details
|
Item
|
Specification
|
|
Material
|
High-Purity 6063 Aluminum Alloy
|
|
Plate Thickness
|
Ultra-Thin Custom (10-25mm)
|
|
Applicable Components
|
CPU / Chip / Precision Sensor
|
|
Working Environment
|
-20°C ~ 70°C Dustproof & Sealed
|
|
Insulation Performance
|
High Insulation & Electric Isolation
|
|
Processing Accuracy
|
±0.05mm Precision Machining
|
-
Ultra-Thin & Lightweight, High Integration: Ultra-thin wall design, minimal overall thickness, no occupation of equipment internal space. Lightweight body effectively reduces the overall load of equipment, suitable for portable and miniaturized electronic products.
-
Precision Uniform Cooling, No Local Overheating: Micro-precision internal flow channel design, uniform heat dissipation coverage, accurate control of component operating temperature. The temperature balance is excellent, which effectively solves the hot spot problem of precision chip heat dissipation.
-
High Safety & Strong Compatibility: Insulated and electrically isolated overall design, safe and non-conductive, avoiding short circuit risk of electronic components. The interface is standardized, compatible with various small circulating cooling systems, and easy to install and fix.
-
Exquisite Craft & Long Service Life: Adopts one-piece precision stamping process, no welding gap, stable sealing. The surface is smooth and wear-resistant, anti-oxidation and anti-fouling, adapting to long-term continuous working state of precision electronic equipment.
How it work
-
The liquid cold plate functions as a compact heat exchanger integrated directly into the battery pack structure.
Thermal Interface: Battery cells transfer waste heat through a thermal interface material to the cold plate's flat contact surface. The high thermal conductivity of 3003 aluminum rapidly conducts this heat into the channel walls.
Fluid Dynamics: Coolant enters through the inlet port and is distributed into the stamped channel network. The channel geometry is designed via computational fluid dynamics to induce controlled turbulence at the target flow rate — typically 2–10 L/min per plate. This turbulent flow disrupts the thermal boundary layer that would otherwise insulate the channel walls, dramatically increasing heat transfer efficiency.
Heat Rejection: As coolant flows through the serpentine or parallel channel matrix, it absorbs thermal energy and exits at an elevated temperature through the outlet port. The heated fluid travels to an external radiator, chiller, or heat exchanger where the thermal energy is dissipated to ambient air before the cooled fluid recirculates.
Structural Integrity: The continuous brazed bond between the stamped top plate and the flat bottom plate forms a pressure vessel capable of withstanding pump pressures, thermal expansion stresses, and vibration loads encountered in automotive and stationary storage environments. Unlike gasketed or O-ring sealed plates, there are no elastomeric elements to deteriorate or relax over time.
FAQ
Q1: I don’t have a finalized design. Can you help from the concept stage?
Absolutely. That is the core of our one-stop service. Share your heat load, space envelope, and target thermal performance. Our engineers will propose an initial flow channel design, run CFD simulations for your approval, and then move to prototype. We guide you from idea to serial production.
Q2: What is the minimum order quantity (MOQ) for custom liquid cooling plates?
We have no fixed MOQ for the prototype and NPI (New Product Introduction) stage. For mass production, we work flexibly with your volumes. As a factory serving global clients, we comfortably handle everything from small pilot runs to millions of pieces annually.
Q3: How do you ensure zero leaks in a water-cooled battery pack?
Quality is built in from the start. We use vacuum brazing for high-integrity joints and 100% test every single plate with a helium mass spectrometer, achieving leak rates tighter than 1*10⁻⁹ Pa·m³/s. Additionally, we conduct pressure cycling and thermal shock tests on pre-production samples validated according to customer durability requirements.
Q4: Do you hold certifications for the North American and Asian markets?
Yes. Our manufacturing is certified to ISO 9001 and IATF 16949. Our materials and components comply with RoHS, REACH, and UL standards as required by your product. We are also experienced in supporting customers through final system-level UL 9540A or UN 38.3 certification by providing detailed design and material documentation.
Q5: What kind of warranty and after-sales support do you offer for your cooling plates?
We stand behind our workmanship. Our standard product warranty is 5 years when properly operated within specified parameters. In the rare event of an issue, our engineering team provides root cause analysis and works to resolve it immediately. For ongoing production, we maintain complete traceability records tied to each batch.
